PACKAGE.PDF
| The scope of application | version | upload time | size | |
|---|---|---|---|---|
| 3.9 | 2025-05-14 | 723KB | ||
| Common package dimensions for CH series ICs: DIP, SKDIP, SDIP, SOP, SSOP, MSOP, QFP, LQFP, QFN, ... | ||||
| download | ||||
| The scope of application | version | upload time | size | |
|---|---|---|---|---|
| 3.9 | 2025-05-14 | 723KB | ||
| Common package dimensions for CH series ICs: DIP, SKDIP, SDIP, SOP, SSOP, MSOP, QFP, LQFP, QFN, ... | ||||
| download | ||||